Extreme Networks Summit X460-G2 Fan Module

Extreme Networks Summit X460-G2 Fan Module blæserenhed (front-til-bagside)

Producent: Extreme Networks
Produkt nr.: 10945
EAN: 0644728109456
Varenummer: F4178004
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Leveringstid: 2 hverdage
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Produktbeskrivelse Extreme Networks Summit X460-G2 Fan Module - blæserenhed (front-til-bagside)
Produkttype Blæserenhed (front-til-bagside)
Designet for ExtremeSwitching X460-G2 Series X460-G2-24p-10GE4, X460-G2-24p-GE4, X460-G2-24t-10GE4, X460-G2-24t-GE4, X460-G2-24x-10GE4, X460-G2-48p-10GE4, X460-G2-48p-GE4, X460-G2-48t-10GE4, X460-G2-48t-GE4, X460-G2-48x-10GE4
Produkttype Blæserenhed (front-til-bagside)
Designet for Extreme Networks ExtremeSwitching X460-G2 Series X460-G2-24p-10GE4, X460-G2-24p-GE4, X460-G2-24t-10GE4, X460-G2-24t-GE4, X460-G2-24x-10GE4, X460-G2-48p-10GE4, X460-G2-48p-GE4, X460-G2-48t-10GE4, X460-G2-48t-GE4, X460-G2-48x-10GE4

The Summit X460-G2 series is based on extreme networks revolutionary ExtremeXOS, a highly resilient OS that provides continuous uptime, manageability and operational efficiency. Each switch offers the same high-performance, non-blocking hardware technology, in the extreme networks tradition of simplifying network deployments through the use of common hardware and software throughout the network.
The Summit X460-G2 switches are effective campus edge switches that support Energy Efficient Ethernet (EEE - IEEE 802.3az) with IEEE 802.3at PoE-plus and can also serve as aggregation switches for traditional enterprise networks. TheSummit X460-G2 series is also an option for DSLAM or CMTS aggregation, or for active Ethernet access.
The Summit X460-G2 can also be used as a top-of-rack switch for many data center environments with features such as high-density Gigabit Ethernet for concentrated data center environments; XNV (ExtremeXOS Network Virtualization) for centralized network-based Virtual Machine (VM) inventory, VMlocation history and VM provisioning; direct attach to offload VM switching from servers, thereby improving performance; high-capacity layer 2/layer 3 scalability for highly virtualized data centers; and intra-rack and cross-rack stacking withindustry-leading flexibility.