Produktbeskrivelse
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Antec Formula 6 - termisk paste
|
Produkttype
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Termisk paste
|
Produktdatablad |
|
Produkttype |
Termisk paste |
Termisk konduktivitet |
5.3 W/mK |
Min. driftstemperatur |
-30 °C |
Maks. driftstemperatur |
250 °C |
Antec's Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec's Formula 6 for a diamond-caliber solution.